Summary: The evolution from subtractive to modified semi-additive (mSAP) and semi-additive (SAP) processes has heightened the importance of electroless plated (ELP) copper (Cu) peel strength in the printed circuit board industry. This study introduces a wet process for depositing Cu on liquid crystal polymer (LCP) using advanced electroless plating. incorporating a polyethylenimine (P... https://www.pipingrockers.shop/product-category/fenugreek/