Aiming at devices for bioelectronic medicine. this paper proposes a die embedding process for the fabrication of flexible smart implants. By combining thinned bare dies with a polymeric encapsulation. completely flexible implants can be designed. https://www.diegojavierfares.com/deal-find-Headlight-Protectors-Suits-Mitsubishi-Lancer-CE-8-98-9-03-M245H-Headlight-quick-pick/